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CoWoS · podgraph

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CoWoS

Product · mentioned 2 times

Chip-on-wafer-on-substrate (CoWoS) advanced packaging technology from TSMC used to assemble AI accelerators.

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The Information's TITV· 4 Nov
CJ Muse says the cycle began with TSMC sold out and under-shipping by 20% to its customers and unable to build enough CoWoS, and now includes substrate constraints and semiconductor equipment shortages, including for parts such as ball bearings.